HomeNews ReleasesSolutionsProduct InformationCustomer SupportCustomer SatisfactionContact
Bringing science to comfortable living through advanced Kiru, Kezuru, Migaku technologies.
Kiru: Cutting, Kezuru: Grinding, Migaku: Polishing
Due to a power supply equipment inspection, this web site will not be accessible
between 08:00 and 17:30 on Sunday, September 7 (Japan time).
Details
Kiru, Kezuru, Migaku Topics
Cutting and Planarization Using a Surface Planer New!
Blade Dicing
Laser Dicing
Stealth Dicing Application
Grinding
Stress Relief
Cutting using a water jet saw
DBG
Others
Applications Example  
Solutions Support    
Dicing New!
Applications Support
Grinding
Dicing and Grinding Service
Polishing
 
DBG
 
Details
Precision Machines  
Dicing and Cutting Saws
Laser Saws
Grinders
Polishers and Dry Etchers
Surface Planer
Products for New Processes
Precision Processing Tools  
Dicing Blades
Grinding Wheels
Dry Polishing Wheels
Other Products  
Accessory Equipment
Related Products
 
Catalog Downloads  
DISCO product catalogs are available in PDF format.
DISCO product catalogs
Adobe Reader *You need to have Adobe(R) Reader to view the PDF files.
   
Training Services
Design Change Notification
Inspection Sheet Search
To Achieve a Better Process Condition
After-Sales Service
Equipment Recycling Service
Non-use of Restricted Substances Certificate Issuance System
Global Network
News Release
Archives
Investors
[August 27, 2008]
Will be displayed at SEMICON Europa 2008 has been added.
[August 8, 2008]
Financial Report for the First Quarter Ended June 30, 2008 (Consolidated)
Notification of Revision of Business Forecast (Fiscal Year 2008)
Notification of Revision of Earnings and Dividend Forecast (Fiscal Year 2008)
[July 30, 2008]
Message from the President has been updated.
[July 29, 2008]
Preliminary Report on Consolidated Sales Figures and Non-Consolidated Earnings Results (First Quarter of Fiscal Year 2008)
DISCO Increases Investment for Construction of New Building at Kuwabata Plant
[July 24, 2008]
Announcement concerning the earthquake in Japan on July 24
Product&Technical Information Archives
Trade Show Information
Investor Information
Corporation Social Responsibility Report 2007
Personal Information Protection Policy
User Agreement
Contact