|
|
 IR
News |
| July 27, 2010 |
|
Will be displayed at SEMICON Taiwan
2010 has been added. |
| July 23, 2010 |
|
Earthquake in Chiba and Ibaraki prefectures, Japan on July 23, 2010 |
| June 23, 2010 |
|
The process of ring removal for TAIKO wafer by circle cutting |
| June 15, 2010 |
|
Completion of a New Building at the Chino Plant |
| June 14, 2010 |
|
Earthquake in Fukushima prefecture, Japan on June 13, 2010 |
| June 3, 2010 |
|
Will be displayed at SEMICON West
2010 has been added. |
| May 31, 2010 |
|
The Applications of a TAIKO Wafer |
| May 27, 2010 |
|
Will be displayed at International LED Lighting Exposition has been added. |
| May 18, 2010 |
|
DISCO awarded #4 customer satisfaction rating among Assembly equipment suppliers by VLSI research survey |
| May 17, 2010 |
|
Improvement in financial management levels in response to the recent business recovery |
| May 14, 2010 |
|
A processing method for gallium arsenide |
|
|
Thickness control by using NCG |
| May 11, 2010 |
|
Will be displayed at ECTC(Electronic Components and Technology Conference) 2010 has been added. |
|
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Will be displayed at SEMICON Russia
2010 has been added. |
| April 22, 2010 |
|
Laser Dicing Solutions新完毕。 |
| April 13, 2010 |
|
Announcement of Early Bank Loan Repayment and Commitment Line Reassessment |
| April 9, 2010 |
|
DISCO's Original OHS Management System Starts at the Head Office |
| April 8, 2010 |
|
Will be displayed at SEMICON
Singapore 2010 has been added. |
| March 24, 2010 |
|
SiC
Dicing using the ZP Blade |
|
|
Merits
of Ultrasonic Wave Processing 3 |
|
|
Processing
of Glass to a Mirror Surface |
|
|
Grinding
Wheels suitable for GaAs Wafers |
|
|
Grinding
of Hollow Wafers |
|
|
Ring
Grinding |
| March 23, 2010 |
|
DISCO
lifts its pandemic alert for new type influenza |
|
|
Donations
for Haiti Earthquake Relief |
| March 19, 2010 |
|
DISCO
Cosponsors the SEMI High Tech U Program for High School Students |
|
|
Promoting
Production Efficiency of the DISCO Group |
|
|
DISCO
is Ranked Eighth among the Best Workplaces in Japan |
| March 17, 2010 |
|
DISCO Group
Biodiversity Action Guidelines |
| March 16, 2010 |
|
关于变更DISCO TECHNOLOGY (SHANGHAI) CO.,
LTD. 公司名称的通知 |
| March 15, 2010 |
|
Earthquake
in Fukushima prefecture, Japan on March 14, 2010 |
| March 8, 2010 |
|
Notice
of relocation: DISCO HI-TEC AMERICA, INC. Eastern Regional Sales & Service Office |
| March 4, 2010 |
|
About an
earthquake in southern part of Taiwan, March 4th, 2010 |
|
|
DISCO
receives Intel's prestigious supplier continuous quality improvement award |
| March 3, 2010 |
|
SEMICON China 2010出展产品。 |
| March 1, 2010 |
|
Tsunami
waves following Chile earthquake on February 28, 2010 |
| February 22, 2010 |
|
DISCO
Laser Saws Sales Exceed 200 |
| February 15, 2010 |
|
Construction
of a New Building at the Kure Plant |
|
|
Completion
of a New Building at the Kuwabata Plant for Manufacturing Precision Processing Equipment and Tools |
| February 2, 2010 |
|
Introducing
the Ultrasonic Dicing Technology, Effective for the Processing of SiC for Power Semiconductors |
| January 22, 2010 |
|
DISCO adds
pandemic diseases to its list of possible threats Surveillance audit for "BS25999-2:2007", the Standard
for BCMS is conducted |
| January 8, 2010 |
|
DISCO achieved
a five star rating from VLSI Research Inc's Customer Satisfaction Survey |
| January 7, 2010 |
|
Will be displayed at SEMICON
Korea 2010 has been added. |
|
|
Will be displayed at 11th
IC PACKAGING TECHNOLOGY EXPO has been added. |
