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1965-1974 The challenge of machine development

TOP 1956-1964 1975-1984
Company History Product History
1965
1968
Ultra-thin (thickness 40 µm) resinoid cutting wheel, MICRON-CUT, developed.
DISCO ABRASIVE SYSTEMS, INC. established in US.
1969
1970
DAS/DAD slicing machines developed and released.
 
1974

And DISCO's abrasive wheels continued to grow thinner. In 1968 DISCO introduced Micron-Cut, a cutoff wheel just 40 micrometers thick. In 1968 Micron-Cut won the New Product Award of the Nikkan Kogyo Shimbun, a leading industrial newspaper, as one of the ten most significant new products of 1968.

On thing stood in the way of even greater success, however. When a problem was encountered in processing, the machine manufacturers usually blamed it on the DISCO abrasive wheel. On the other hand, DISCO felt no machine existed that could truly take advantage of the high quality of its precision abrasives. Even when DISCO had custom-specification machines made, they did not meet expectations. Finally, DISCO decided that, if it wanted to offer truly spectacular results to the customer, it would have to build the machines itself. It was at this time that DISCO began to demonstrate the necessity of harmonizing machine, abrasive, and application to provide complete and integrated solutions.

As its technology developed both in variety and sophistication, DISCO also became a global company. In 1969, even before the term "Silicon Valley" was coined, DISCO established there its first overseas subsidiary: DISCO Abrasive Systems, Inc.

The 1970s saw many DISCO dreams come to fruition. In 1974, DISCO was chosen by the Japanese government to slice a moon rock given to Japan by the United States (the rock had been brought back to earth by Apollo 11). The success of this technologically difficult job wowed the Japanese public and won DISCO acclaim even outside its industry.

TOP 1956-1964 1975-1984

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