Then, seven years after the launch of Micron-Cut, a DISCO R&D team, under the leadership and guidance of Shinji Sekiya (Executive Director at the time), developed the DAD-2H, the precursor to the modern-day dicing saw. Debuting at SEMICON West in Silicon Valley, the machine was kept running continuously
during the show and quickly gained a reputation for high-quality and unstoppability.
In less than 40 years, DISCO had transformed itself from a small abrasives shop to a leading manufacturer
of advanced diamond products and precision machines for the electronics and semiconductor industries. In 1977,
Dai-Ichi Seitosho Co., Ltd. took the D, I, S, and CO in its name and became DISCO Abrasives Systems, Ltd.,
a name that reflected its new and modern approach to technology.