Materials & Process Images
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| Note: |
DISCO also has experience in processing for applications other than those listed below.
Please contact us, if you have any inquiries. |
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| Processing |
Final Device |
Material |
Grooving
& Blade Full Cut |
• Memories
• CPUs/Logic circuits
• PC boards
• HTCC |
Low-k |
| Aluminum nitride (AlN) |
| Epoxy layer |
| Full cut |
• SAW filters
• RF
• Aluminum oscillators
• Solar batteries
• MEMS
• Optical waveguides
• Power devices
• LED |
Silicon (Si) |
| DAF (Die Attach Film) |
| Gallium arsenide (GaAs) |
| Silicon carbide (SiC) |
| GaAs with backside metal |
| Si with backside metal |
| PZT (<150umt) |
| Gallium nitride (GaN) |
| Gallium phosphide (GaP) |
| Indium phosphide (InP) |
| InGaAlP |
| Germanium (Ge) |
| SOI wafers |
| Copper (Cu) |
| Molybdenum (Mo) |
| Tungsten (W) |
| Nickel (Ni) |
Scribing
& Die Separation |
• LED |
Sapphire (Al2O3) |
| Silicon carbide (SiC) |
| Alumina ceramics |
| Hasen cut |
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Silicon (Si) |
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 Grooving & Blade Full Cut |
| Low-K |
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Aluminum nitride (AlN) |
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Full cut |
| Thin silicon 50µmt |
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Silicon + DAF
(Si＋DAF) |
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Silicon carbide (SiC) |
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| Gallium arsenide (GaAs) |
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Scribing & Die Separation |
| Sapphire (Al2O3) |
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Alumina ceramics |
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Hasen cut |
| The Hasen cut technology enables full cut of multi-chip modules and polygonal die. |
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| Silicon multi-chip |
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