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DISCO HOME > Laser Dicing Solutions > DISCO Laser Performance > Materials & Process Images

Laser Dicing Solutions


Materials & Process Images

Materials
Note: DISCO has experience in processing of workpieces other than the below.
Please contact us, if you have any inquiries.
Ablation
Ablation
Processing Final Device Material
Grooving
& Blade Full Cut
• Memories
• CPUs/Logic circuits
• PC boards
• HTCC
Low-k
Aluminum nitride (AlN)
Epoxy layer
Full cut • SAW filters
• RF
• Aluminum oscillators
• Solar batteries
• MEMS
• Optical waveguides
• Power devices
• LED
Silicon (Si)
DAF (Die Attach Film)
Gallium arsenide (GaAs)
Silicon carbide (SiC)
GaAs with backside metal
Si with backside metal
PZT (<150umt)
Gallium nitride (GaN)
Gallium phosphide (GaP)
Indium phosphide (InP)
InGaAlP
Germanium (Ge)
SOI wafers
Copper (Cu)
Molybdenum (Mo)
Tungsten (W)
Nickel (Ni)
Scribing
& Die Separation
• LED Sapphire (Al2O3)
Silicon carbide (SiC)
Alumina ceramics
Hasen cut Silicon (Si)

Stealth Dicing
Stealth Dicing
Processing Final Device Material
Full cut • MEMS
• LED
Sapphire (Al2O3)
Gallium arsenide (GaAs)
Lithium tantalite (LT)
Thin silicon
Glass
MEMS
Hasen cut Silicon (Si)
Process Images
Ablation Stealth Dicing
  • Sapphire (Al2O3) Gallium arsenide (GaAs) Lithium tantalite (LT)
    Sapphire (Al2O3) Gallium arsenide (GaAs) Lithium tantalite (LT)
    Thin silicon Glass
    Thin silicon Thin silicon Glass
    MEMS
    MEMS
  • Hasen cut
    The Hasen cut technology enables full cut of multi-chip modules and polygonal die.
    Hasen cut
    Silicon (Si)
    Silicon (Si)
Laser Dicing Solutions

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