Product&Technical Information Archives
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| This is a list of updated status regarding DISCO products and technology. |
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| December 7, 2007 |
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LTCC Dicing |
| November 27, 2007 |
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Development of the Ultrathin Hub Blade ZHZZ Series to realize the 10 µm Kerf |
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Development of the ZHCR Series Reduces Tip Shape Collapse of Thick Blades |
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Development of the GS08 Series Realizes High-Quality Grinding of SiC |
| November 20, 2007 |
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Development of the New DGP8761 300 mm Wafer Fully Automatic Grinder/Polisher, the Newly Developed E PAD Stress Relief Polishing Pad, and the New DFM2800 Fully Automatic Wafer Mounter |
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Development of the DDS2300 Fully Automatic Die Separator to Precisely Separate DAF |
| November 6, 2007 |
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Development of a New Wafer Thinning Solution, the "UltraPoligrind" Wheel |
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Development of the DP08 Series Dry Polishing Wheel for Stress Relief |
| October 30, 2007 |
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Product release of the DFD6362 Fully Automatic Dicing Saw with improved productivity for 300 mm wafers |
| October 23, 2007 |
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Development of the new DFL7260 laser saw capable of supporting two laser heads |
| October 22, 2007 |
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Wheel Shape for Wafer Thinning |
| October 15, 2007 |
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DISCO has developed a new laser saw DFL7340/7360 using stealth dicing technology in cooperation with Hamamatsu Photonics |
| August 13, 2007 |
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EAD6750, A New, Automatic Dicing Engine for Package Singulation has been added. |
| July 6, 2007 |
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Lithium Tantalite (LT) Dicing |
| July 5, 2007 |
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Merits of TAIKO grinding |
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Introduction to StayCool (Cutting liquid for QFN package cutting) |
| May 16, 2007 |
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Cutting using a water jet saw |
| May 7, 2007 |
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DBG + DAF Laser Cut |
| April 20, 2007 |
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"Discontinued Machines List" has been updated. |
| April 13, 2007 |
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New conditions and chips for conditioning |
| April 4, 2007 |
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Ultra-Thin Grinding |
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Laser Full Cut Dicing |
| March 26, 2007 |
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Die chipping countermeasure for the DBG process |
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Profile processing using a dicer -2 |
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Wafer edge chipping countermeasure |
| March 1, 2007 |
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Glass Grinding |
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Effectiveness of Step Cut and Bevel Cut |
| January 31, 2007 |
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DBG Processing of Wafer level-CSP (Patent Pending) |
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Kerf Check Function |
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