Product&Technical Information Archives
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| This is a list of updated status regarding DISCO products and technology. |
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| December 2, 2009 |
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Introducing the DFG8340, a grinder for processing φ8" wafers to an extremely precise degree of flatness |
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Introducing the DAD342 for φ8" Wafers: Compact Dicing Saw with a Width of only 650 mm |
| November 30, 2009 |
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Introducing the DGP8761 High Level Cleaning Specification: Grinder for φ300 mm Wafers to Provide Better Cleanliness After Thinning |
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Introducing the Gettering DP Wheel, a New Solution for Wafer Ultrathin Finishing: Maintaining the Gettering Performance through the Dry Polishing Process |
| November 18, 2009 |
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Introducing the DFL7020, Economical and Small Footprint Fully Automatic Laser Saw to Scribe Sapphire LED |
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Introducing the DFL7161, Fully Automatic Laser Saw for 300 mm Wafers with Enhanced Basic Performance |
| November 16, 2009 |
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Introducing the Fully Automatic Thinning Process of Sapphire Substrates for LED |
| November 11, 2009 |
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Introducing the Z09 Series, Electroformed Blades with Fine Grit Size and High Strength Bond |
| November 9, 2009 |
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Introducing the DFD6341, fully automatic dicing saw for 200 mm diameter wafers with enhanced productivity |
| October 23, 2009 |
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Introducing
the DFD6760, fully automatic dicing saw for 300 mm diameter wafers with enhanced productivity |
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Introducing
the DAD3650, the world's smallest dual-spindle automatic dicing saw |
| October 9, 2009 |
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Development of the DAS8930
surface planer supporting 300 mm wafers for high-precision cutting and planarization |
| August 4, 2009 |
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StayClean-A has
been added. |
| July 13, 2009 |
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Introduction of Multiple-Workpiece
Mounting Function |
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Processing Irregular-Shaped
Wafers Using the Shape Recognition Function |
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Alignment using
an IR Camera |
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Multiple Workpieces
Grinding |
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Stress Relief for
the DBG Process |
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SiC High Quality Processing |
| June 10, 2009 |
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Processing Sapphires
with Lasers |
| May 13, 2009 |
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Development of a Sapphire
Substrate Stealth Dicing Process Offering High-Quality, High-Yield Production of High-Intensity LEDs |
| April 22, 2009 |
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DWR1720 Deionized Water
Recycling Unit |
| January 19, 2009 |
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Stress Relief Using
Plasma Etching |
| January 9, 2009 |
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Features
of the New UltraPoligrind wheel |
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Stable Grinding
of 6-inch AlTiC Wafers |
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