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DISCO HOME > News Releases > Product&Technical Information Archives

Product&Technical Information Archives


This is a list of updated status regarding DISCO products and technology.
2011 2010 2009 2008 2007
December 2, 2011 Introducing the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers
November 28, 2011 Introducing the DFG8830, a grinder with a 4-axis and 5-chuck table configuration for hard and brittle materials such as sapphire and SiC
November 24, 2011 Introducing the energy saving DTU1540 Water Temperature Control Unit
DISCO Has Developed Technology for Separating and Recovering Silicon Sludge from Grinder Wastewater
November 21, 2011 New Addition to the Stealth Dicing Laser Saws for 300 mm Wafers
Introducing the DFL7360FH with Ring Frame Handling Specification
November 17, 2011 Introducing the DFD6560: Ultra-compact Fully Automatic Dicing Saw for 300 mm wafers
November 15, 2011 Announcing the ultra high precision DFS8960 surface planer which supports 300 mm wafers
November 4, 2011 Process using the 3-point edge alignment
September 30, 2011 High-Quality Grinding of Lithium Tantalate
September 29, 2011 DISCO Corporation to boost worldwide sales of the CC Filter a Filtration Unit for Dicing Saw Cutting Water
September 2, 2011 Blade Edge Shape Correction: Flat Dress
July 29, 2011 6-inch GaAs Wafer Thinning when it is Secured with Tape
Jun 30, 2011 Profiling using a dicing saw 4
Jun 14, 2011 For Your Safety - Rotation Speed Limit
Jun 3, 2011 LCD Driver Die Strength and Drop Strength
May 17, 2011 Pre-shipment virus scan for Windows-based DISCO equipment
April 7, 2011 Measurement Alignment
March 2, 2011 Warpage due to grinding damage
January 19, 2011 4CH_CUT
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