|
|
 IR News |
| December 25, 2002 |
|
"Environmental Report 2002" has
been added. |
| November 25, 2002 |
|
DISCO Announces A New Automatic Dicing
Saw |
|
|
DISCO Announces A New Automatic Grinder |
| October 24, 2002 |
|
DISCO Announces A New In-feed Surface
Grinder for 300-mm Wafers |
|
|
DISCO Announces A New Dry Polisher for
300-mm Wafers |
| September 30, 2002 |
|
"Safety Sheet on How to
Handle Hub Blade" has been added. |
| September 27, 2002 |
|
DISCO to Issue Share Acquisition Rights
for the Purpose of Granting Stock Options |
| August 6, 2002 |
|
DISCO Announces New 300 mm Fully Automatic
Laser Saw Development |
| August 5, 2002 |
|
The specifications for the DFD6340
(200mm fully automatic dicer) and the DFP8140 (200mm
fully automatic dry polisher) have been added. |
| August 2, 2002 |
|
DISCO Hiroshima Works Environmental Policy has been revised. |
| July 29, 2002 |
|
DISCO Training Center moved. |
| May 30, 2002 |
|
DISCO to Issue Share Acquisition Rights
for the Purpose of Granting Stock Options |
| May 28, 2002 |
|
In Honor of DISCO Head Office Energy Conservation
Efforts, the Grand Prize has been awarded. |
| March 13, 2002 |
|
DISCO Corporation Receives Intel's Prestigious
Supplier Continuous Quality Improvement (SCQI) Award |
