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This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
HANNOVER MESSE 2009
Date & Time
20th - 24th April, 2009
9:00 - 18:00
Location
Exhibition Grounds, 30521 Hannover, Germany
Micro Technology (
Hall 6
)
Booth location
E53/1
Exhibited products
Dicing Blades
•
Z05 series
•
ZH05 series
•
P1A series
•
A1A/K1A series
Grinding wheels
•
GF01 Series BR385
•
Poligrind
Laser cut samples
•
Ablation laser samples
•
Stealth laser samples
Exhibited samples
•
TAIKO grinding wafer
•
Waterjet cut samples
Tecnisco samples
• Ultrasonic machining
• Sandblasting
• Milling
• Sputtering etc.
Tecnisco website:
http://www.tecnisco.co.jp/en/
Entrance fee
Free with advance registration through DISCO HI-TEC EUROPE.
Please contact us by 9th of April.
Contact
contactsales/att/discoeurope/pod/com
Hannover Messe
Website
http://www.hannovermesse.de/homepage_e
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