This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
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DISCO will exhibit processed samples and actual equipment, such as our processing solution for high brightness LED, our laser technology to perform quality dicing of MEMS devices and thin wafers, wafer thinning technology, package singulation and bump planarization.
DISCO will also be offering advice to customers at a process consultation counter. |
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| Precision Machines |
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Dual-spindle automatic dicing saw
 DAD3650
Automatic dicing saw
DAD342
Automatic surface planer
DAS8920 |
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| Precision Processing Tools |
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| Dicing Blades |
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Resin blades for QFN cutting
P08 Series |
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10µm ultrathin hub blades
ZHZZ Series |
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Resin blades for various hard, brittle materials
R07 Series |
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Electroformed blade
ZP07 Series |
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New line up of electroformed blades
Z09 Series |
| Grinding and Dry Polishing Wheels |
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For SiC grinding
GS08 Series |
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Maintains gettering performance in the dry polishing process
Gettering DP |
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| Process Consultation Counter |
| Specialists will be available to discuss customers' inquires regarding Kiru, Kezuru and Migaku. |
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| Tecnisco |
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| TECNISCO LTD., our affiliate company, will display "Cross-edge" micro processing. |
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
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