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DISCO HOME > News Releases > Event Schedule

This event is now over.
Thank you very much for taking the time to visit the DISCO booth.

The highlights
LED process solutions
DISCO will introduce the new process which reduces the processing steps of sapphire substrates.
Laser Technology
DISCO will exhibit a wide range of developed laser applications (stealth dicing, grooving, full cut, etc) with actual processed samples.
Exhibition Information
Precision Machines

Automatic Laser Saw
DAL7020
Process Consultation Corner

Specialists will be available to discuss customers' inquires regarding Kiru, Kezuru and Migaku.
Exhibited Samples

LED process solutions

Laser Dicing Applications

Wafer Thinning Applications

Processing of difficult-to-grind material

Ultrasonic Dicing

TAIKO Process

Compact memory card edge profiling process

Planarization
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