This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
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| Responding to customer needs, DISCO will exhibit cutting edge Kiru, Kezuru and Migaku applications such as laser dicing for high brightness LED, processing of hard-to-grind materials and processing of using ultrasonic technology. |
Consultation for the Dicing & Grinding Service, which is suitable for small-lot production or R&D, is available.
TECNISCO, as a DISCO affiliate company will participate in partnership, exhibiting glass precision parts and metal heat sink. |
| Precision Machines |
Automatic Dicing Saw
 DAD3650
Fully Automatic Dicing Saw
DFD6340
In addition, introduction of machines is available at the booth.
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| Attention |
Attending the exposition is free if you pre-register from the SEMICON Europa website no later than 10 October. Beginning 11 October, the Visitor registration fee is 25 EUR (plus VAT 19%).
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| Contact |
Your comments and questions are welcome.
Please click
to contact us.
For more information, please refer to the SEMICON Europa 2011 Website.
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