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DISCO HOME > News Releases > Event Schedule

This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
Exhibition Information
Exhibited Samples
LED process solutions
Sapphire ground wafers and SD wafers
Stealth dicing (Hasen cut)
DBG（Dicing Before Grinding）process
TAIKO process
Precision Processing Tools
Blades/Wheels
Precision cutting samples from Tecnisco
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