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| * From this year, our booth has been moved to South Hall. |
This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
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| Deionized Water Recycling Unit |
| We will exhibit the DWR1720 super-compact deionized water recycling unit that achieves zero dicing saw wastewater. |
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Additionally, DISCO will exhibit cutting edge Kiru, Kezuru and Migaku applications such as laser dicing or TSV processing, ECO friendly products responding to customer needs.
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| Precision Machines |
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Deionized Water Recycling Unit
 DWR1720
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| Precision Processing Tools |
| Dry Polishing Wheel |
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For chemical-free stress relief
DP08 Series |
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| Workshop |
DISCO will deliver a presentation at "Thin Wafer Processing for 3D TSV Applications Workshop" during SEMICON West.
Please take a look at our latest solution for your processing needs.
| Workshop |
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Thin Wafer Processing for 3D TSV Applications Workshop |
| Organizer |
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SUSS MicroTec |
| Date |
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Wednesday, July 15, 2:20pm, Reception to follow |
| Place |
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St Regis Hotel、Gallery II Seminar Room |
| Title |
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Processes and Challenges for Wafer Thinning and Edge Trimming of Carrier and Device Wafers |
| Speaker |
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Scott Sullivan, Chief technologist, DISCO HI-TEC America, Inc. |
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| Sustainable Technologies Award |
 Deionized Water Recycling Unit "DWR1720" has been selected as one of the finalists for SEMICON West 2009 Sustainable Technologies Award, on June 23, 2009.
This award recognizes SEMICON West 2009 exhibitors who have developed and introduced equipment, materials or services into the marketplace that contribute to sustainable improvement of the environment.
Final judging will be done by a panel of EHS experts after the conclusion of SEMICON West, and the winner will be announced in August.
*Click here for further details. |
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| Contact |
Your comments and questions are welcome.
Please click here to contact us.
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