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DISCO HOME > News Releases > Event Schedule

This event is now over.
Thank you very much for taking the time to visit the DISCO booth.
The highlights
LED process solutions
DISCO will introduce a new process which reduces the processing steps of sapphire substrates.
Laser Technology
We will exhibit a wide range of developed laser applications (stealth dicing, grooving, full cut, etc) with actual processed samples.
Cutting and Planarization
We will also show cutting and planarization solutions using byte grinding and exhibit the actual DAS8930 system.
Exhibition Information
Precision Machines

Fully Automatic surface planer
DAS8930
Exhibited Samples

Processing solution for high brightness LED

Laser Full Cutting

Laser Grooving

Stealth Dicing

Blade Dicing

Ultrathin Wafers

TAIKO Process

Planarization
Process Consultation Corner

Specialists will be available to discuss customers' inquires regarding Kiru, Kezuru and Migaku.
Precision Processing Tools
Dicing Blades
Resin blades for QFN cutting
 P08 series
10µm ultrathin hub blades
 ZHZZ series
Resin blades for various hard, brittle materials
 R07 series
Electroformed blade
 ZP07 series
New line up of electroformed blades
 Z09 series
Other blades
Grinding and Dry Polishing Wheels
To improve die strength
 UltraPoligrind
For SiC grinding
 GS08 series
Maintains gettering performance in the dry polishing process
 Gettering DP
Other wheels
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