November 24, 2010 DISCO's proprietary HogoMax003, a new water-soluble protective film New!
Introducing the DAD3240, Automatic Dicing Saw for φ8" Wafers with the Width of only 650 mm New!
November 22, 2010 Introducing the DWR1721 Deionized Water Recycling Unit with drain water pumping and communication functions with the dicing saw New!
November 16, 2010 Introducing the ZHDG Electroformed Hub Blade Series for High Quality LED Board Cutting New!
Introducing the BH11 Metal Hub Blade Series with Improved Usability New!
October 27, 2010 The dedicated website regarding SEMICON Japan 2010 has been released.