|December 2, 2011||Introducing the DAD3360 Automatic Dicing Saw with extended support for 300 mm wafers New!|
|November 24, 2011||Introducing the energy saving DTU1540 Water Temperature Control Unit New!|
|DISCO Has Developed Technology for Separating and Recovering Silicon Sludge from Grinder Wastewater New!|
|November 21, 2011||New Addition to the Stealth Dicing Laser Saws for 300 mm Wafers.
Introducing the DFL7360FH with Ring Frame Handling Specification New!
|November 17, 2011||Introducing the DFD6560: Ultra-compact Fully Automatic Dicing Saw for 300 mm wafers New!|
|November 15, 2011||Announcing the ultra high precision DFS8960 surface planer which supports 300 mm wafers|