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DISCO HOME > News Releases > 2010

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2010 2009 2008 2007 2006
IR News
March 8, 2010 Notice of relocation: DISCO HI-TEC AMERICA, INC. Eastern Regional Sales & Service Office
March 4, 2010 About an earthquake in southern part of Taiwan, March 4th, 2010
DISCO receives Intel's prestigious supplier continuous quality improvement award
March 3, 2010 Will be displayed at SEMICON China 2010 has been added.
March 1, 2010 Tsunami waves following Chile earthquake on February 28, 2010
February 22, 2010 DISCO Laser Saws Sales Exceed 200
February 15, 2010 Construction of a New Building at the Kure Plant
Completion of a New Building at the Kuwabata Plant for Manufacturing Precision Processing Equipment and Tools
February 2, 2010 Introducing the Ultrasonic Dicing Technology, Effective for the Processing of SiC for Power Semiconductors
January 22, 2010 DISCO adds pandemic diseases to its list of possible threats Surveillance audit for "BS25999-2:2007", the Standard for BCMS is conducted
January 8, 2010 DISCO achieved a five star rating from VLSI Research Inc's Customer Satisfaction Survey
January 7, 2010 Will be displayed at SEMICON Korea 2010 has been added.
Will be displayed at 11th IC PACKAGING TECHNOLOGY EXPO has been added.


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