DISCO Announces A New Automatic Dicing Saw
TOKYO, - November 25, 2002 - DISCO Corporation has announced the DAD3350 (photo 1), automatic dicing saw, that can process up to 250-mm square workpieces. It will be exhibited at SEMICON Japan 2002 in Tokyo, from December 4 to December 6 (Booth number: Hall No.4, A904).
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| DAD3350 |
General description
The DAD3350 includes auto alignment, auto focus and auto kerf check for improved productivity and a touch panel LCD screen graphical user interface for easy of operation.
Development background
In addition to processing semiconductor wafers, the DAD3350 has been developed to process electronic components (green ceramic), optical components and other devices. The dicing saw can also be customized to process materials from ultra-thin to several millimeters thick, single wafer or multiple panels, straight cut or optical angle cut. DISCO is aiming for sales of one hundred dicing saws in the first year.
DAD3350 Features
Sales for the first year are expected to be 3.0 billion yen.
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Various applications |
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The DAD3350 supports a maximum workpiece size of 250 mm square. It can be fitted with either a 1.8 kW spindle (standard specification) for 2-inch blades or 2.2 kW high torque spindle (option) for 3-5 inch blades. |
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Process quality |
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By employing a bridge-type frame structure made from cast iron and a front mounted spindle, rigidity and stability is maximized. |
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Process Controls |
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The DAD3350 includes advanced pattern recognition system with auto alignment, auto focus, and auto kerf check for improved productivity. Also, process control features such as a cutting water flow control and a spindle current monitor are included to support process analysis. |
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Machine Utilization |
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The return feed speed of the x-axis, y-axis and theta axis has been enhance to ensure that the DAD3350 spends more time cutting and less time waiting to cut. |
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Easy Operation |
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The dicing saw employs a touch panel LCD screen graphical user interface with real time display illustrating process details. |
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Small Footprint |
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The bridge type frame structure has realized a footprint of 0.945 m2. |
Release schedule
The DAD3350 will be released and exhibited at SEMICON Japan, December 2002. After SEMICON Japan, receipt of orders and demonstrations at DISCO Japan's application laboratory will start. Shipments are planned to start from May 2003.
Other information
| Machine dimension (mm): 900 (W) x 1,050 (D) x 1,800 (H) |
| Machine Weight (Kg): 1,300 (approximate) |
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Contact:
DISCO Corporation
Corporate Strategy Division
Management Strategy Department
Marketing Communications Team
Phone: 03-4590-1090Fax: 03-4590-1094 |
DISCO is the leading supplier of precision cutting (KIRU), grinding (KEZURU) and polishing (MIGAKU) solutions to the global semiconductor and electronic industries.
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