Development of the GS08 Series Realizes High-Quality Grinding of SiC
DISCO Corporation has developed new grinding wheel "GS08 Series" to respond to diverse
processing needs, following progress in miniaturization and high functionalization of electronic devices.
This product will be on displayed at SEMICON Japan 2007 in December.
Development Background
SiC wafers have been used as a substrate for blue and white LEDs thus far. It is expected that SiC will also be used in power and RF devices due to its merits of high-speed operation, low-power loss, high-voltage resistance, and high-temperature operation.
However, because SiC is extremely hard it is very difficult to grind compared to silicon, which is the typical semiconductor wafer material. Processing methods that use existing slurry have been applied, however, because lower cycle time and slurry treatment cost are needed, the establishment of high-quality grinding with fixed abrasive is required.
In response to these needs, DISCO has developed the GS08 series grinding wheel which realizes high-quality grinding of SiC wafers at a similar level to silicon wafers.
Product Characteristics
The GS08 series is a grinding wheel that enables high-quality grinding of SiC wafers as a result of its uniquely developed porous vitrified bond. Since it processes with a fixed abrasive, it does not need slurry and it can realize high-quality grinding equivalent to silicon.
Silicon wafer grinding involves two steps, with Z1-axis performing rough grinding and Z2-axis performing fine grinding. However, with the development of the GS08 series, it is possible to implement fine grinding with just the Z1-axis.
<Grinding surface roughness>
Measured surface roughness of the wafer circumference for a φ3 inch SiC.
The GS08 series achieves about the same quality as conventional silicon grinding.
Schedule
December 2007
On display at SEMICON Japan 2007
January 2008
Sample orders start
Pursuing a higher quality grinding surface
Although currently under development, DISCO is achieving high-quality SiC grinding surface with the next generation wheel, based on the GS08 series.
Contact: Aya Osumi
Marketing Communications Team,
Marketing Communications Department,
Corporate Strategy Division
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
