Compact 600 mm-wide DAL7020 Compact Laser Saw Development
DISCO Corporation (Headquarters: Ota-ku, Tokyo; President: Hitoshi Mizorogi) has created the DAL7020 Automatic Laser Saw for 6" wafers. Cutting and grooving of sapphire and other small parts is the main target. The DAL7020 will be exhibited at the SEMICON Japan 2008 trade show, scheduled to be held this December.
Development backgroundIn recent years, production volumes of high brightness LEDs have been on the rise to meet the increasing demand for their use in lighting, automotive applications, etc. Sapphire wafers, which are used in the manufacture of high brightness LEDs, have conventionally been cut by creating grooves and separating the wafer with a diamond scriber.
However, as demands for high brightness LEDs expand, the need has increased for laser scribing that enables high-speed and stable cutting, as a process, to simultaneously increase both productivity and yield.
The new DAL7020 utilizes the expertise cultivated with the development of the DFL7160 Fully Automatic Laser Saw, which has already achieved impressive accomplishments within the industry. The space-saving design omits the handling mechanism while still maintaining the same cutting quality as conventional laser saws. The DAL7020 adds a base model to the DISCO laser saw lineup that is also ideal for applications such as the development of new products.
DAL7020 features
<Space-saving design>
Space-saving has been pursued in all aspects of the design. This has resulted in a 600 mm wide machine, which is the slimmest in the DISCO laser saw lineup, and contributes to the effective use of floor space in the clean room.
<Easy operation>
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The DAL7020 has a simple, versatile design, ideal for R&D applications.
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An auto alignment mechanism is a standard feature. This lightens the operator's workload, and contributes to increase productivity even as a manual machine.
<Diverse options>
A wide range of options can be selected to support various applications according to user needs.
(Option examples)
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Chuck backside alignment mechanism: Enables cutting of a workpiece, for which the pattern is not visible from the frontside, by aligning from the chuck table side (the backside of the workpiece).
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Shape recognition function: Enables efficient cutting, even of broken wafers or other unusually shaped workpiece.
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Height sensor: Enables proper cutting of highly warped wafers by automatically adjusting the height of the cutting point.
Schedule
December 2008
System will be showcased at SEMICON Japan
June 2009
Sales of the system will commence
Contact:
Aya Osumi
Corporate Communications
DISCO Corporation
E-Mail:
Phone: 81-3-4590-1090
