Introducing the DFD6760, fully automatic dicing saw for 300 mm diameter wafers with enhanced productivity
DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has newly developed the DFD6760. This fully automatic dicing saw with two chuck tables and two spindles for 300 mm diameter wafers will be exhibited at SEMICON Japan 2009 (December 2 to 4 at Makuhari Messe).
Development Background
In recent years, efforts aiming at reduction of production costs, such as use of 300 mm diameter wafers, have been mainly made for memory devices. It is anticipated that this trend will continue in the future. Following such trend, DISCO has developed the DFD6760 fully automatic dicing saw in order to meet requests for further improvement of productivity. |
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DFD6760 Features
Two chuck tables and an independent microscope for alignment are installed: during the dicing on one chuck table, preparatory operations, such as transport and alignment, are conducted on the other chuck table at the same time. This system enables nonstop and efficient dicing.
Especially in the case of a device whose preparatory operation time before dicing is long, such as when using the NSD* for a DAF (die attach film) half cut in the dicing of a thin DAF-attached wafer, substantial improvement of productivity is expected.
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* The NSD (non-contact surface detector) measures the position on the wafer upper surface by detecting back pressure when exhausting air from the nozzle. This function controls the cut depth based on the wafer upper surface, not controlling the uncut depth based on the chuck table where the chuck table or a variation in the thickness of the dicing tape affects the cut depth. Therefore, it can realize a very accurate half cut.
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Schedule
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Unveiling at SEMICON Japan
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December 2009
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Launch of sales timing
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Not determined yet
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