Introducing the DFD6341, fully automatic dicing saw
for 200 mm diameter wafers with enhanced productivity
DISCO Corporation (Head Office: Ota-ku, Tokyo; President: Kazuma Sekiya) has newly developed the DFD6341. This fully automatic dicing saw, which realizes even higher productivity, with two spindles for 200 mm diameter wafers will be exhibited at SEMICON Japan 2009 (December 2 to 4 at Makuhari Messe).
Development Background
In recent years, efforts aiming at further reducing the production costs have been made in device manufacturing. It is anticipated that this trend will be intensified in the future. In order to meet this demand for cost reduction, DISCO has improved the existing DFD6340, which has been installed at quite a few production sites worldwide, and developed the DFD6341 fully automatic dicing saw to provide even better productivity.
Features of the DFD6341
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< Enhanced productivity >
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The DFD6341 realizes 15% greater UPH (unit per hour) compared with the DFD6340 by incorporating technologies to increase productivity, such as higher speed to feed the X-, Y- and Z-axes and to move main transport parts as well as a shorter distance between the blades.
Especially, the X-axis contributes to the substantial improvement of throughput because its movement range at the highest speed is enlarged thanks to its enhanced acceleration and deceleration performance.
The fast alignment function (optional), newly installed to the DFD6341, improves UPH by 17% over the DFD6340 because alignment operation can be made without stopping the workpiece.
Note: UPH varies depending on the workpiece size and processing parameters.
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< Improved space efficiency >
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The DFD6341 has a smaller footprint than the DFD6340 by 3%. In spite of this compactness, the DFD6341 can have the four units of transformer, uninterruptible power supply (UPS), CO2 injector, and pressure pump (instead of the conventional two units in the DFD6340) built-in at the same time thanks to a modification in parts used and internal layout. Because of this, no additional space is required even when these optional accessories are necessary, so you can make efficient use of the clean room space.
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Schedule
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Unveiling at SEMICON Japan
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December 2009
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Launch of sales
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July 2010
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