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Press Release

February 2, 2010

Introducing the Ultrasonic Dicing Technology,
Effective for the Processing of SiC for Power Semiconductors

DISCO Corporation (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya) has developed a dicing technology, which applies ultrasonic waves, as a solution to process SiC (silicon carbide) used in currently popular power semiconductor devices.

Background
While the society is more interested in reducing CO2 emission in order to prevent global warming, power semiconductors*1 have attracted a great deal of notice, as one of the next-generation eco-friendly devices. However, SiC used as a substrate of this power semiconductor module is very hard. Because of this, it is extremely difficult to dice (cut) this material in the singulation process and the challenge is to provide a process with high productivity.
In order to solve this problem, DISCO has developed an ultrasonic dicing unit that can be installed to the existing dicing saws as a retrofit.
 

*1

Power semiconductors:
Semiconductor devices used as electrical switchers, such as inverters and converters. Their applications have been greatly expanded, including use in hybrid cars, electric vehicles, and air conditioners.

Advantages of the dicing using ultrasonic waves

Since the diamond blade expands and contracts in the radial direction thanks to the ultrasonic vibration, this innovative dicing unit processes a workpiece while intermittently making contact (see Fig. 1). This makes it possible to improve the blade cooling condition, which enables substantially reducing the processing load.

Utilizing the effect of less processing load, this dicing unit can process at a speed higher than the conventional type or can use a high-grit size blade (finer). This greatly contributes to better throughput and quality.

The SiC dicing process using ultrasonic waves realized 3.3 times the feed speed (process speed) compared with the conventional dicing blade (see Fig. 2).
Fig. 1: Comparison of Dicing
Conventional dicing using a blade Dicing using ultrasonic waves
Fig. 2: Close-ups of the Processing Results of SiC
Conventional dicing using a blade Dicing using ultrasonic waves
Feed speed: 3 mm/sec Feed speed: 10 mm/sec
Conclusion
It is anticipated that the SiC processing needs will further be increased in the future.
In addition to the dicing using ultrasonic waves, DISCO has developed high-speed SiC dicing process using a laser and highly accurate grinding and polishing technologies. DISCO’s high level technical capabilities in each aspect of Kiru (cutting), Kezuru (grinding), and Migaku (polishing) enable providing an optimal solution for each application.
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