DISCO Laser Saws Sales Exceed 200
DISCO Corporation (Headquarters: Ota-ku, Tokyo; President: Kazuma Sekiya) has announced that the sales of the laser saws launched in 2002 reached 200 in January 2010. This record was achieved four months ahead of the May 2010 target established in the planning at the beginning of this year.
As background to this early achievement, DISCO's unique stealth dicing technology for high-intensity LEDs has been highly evaluated by major LED manufacturers all over the world. Accordingly, the DFL7340 laser saw having this technology has been shipping at a pace greatly exceeding the estimate, and the laser saws for Low-k film grooving, which is commonly used in high-speed devices currently, has also sold steadily.
So far DISCO's business consists of three segments: dicing saws, backgrinders, and precision processing tools (consumables). The sales results in 2009 indicate that the laser saw business, which has been steadily developing, has now grown to a new strength for DISCO supported by strong LED demand.
History of DISCO Laser Business
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April 2001
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Started development.
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December 2002
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Launched DISCO's first laser saw, the DFL7160.
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November 2005
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Launched a laser saw for DAF (die attach film) cutting.
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November 2006
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Launched a laser saw for sapphire grooving.
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October 2007
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Announced the business collaboration with Hamamatsu Photonics K.K. and launched the DFL7340/7360 using the stealth dicing technology developed by Hamamatsu.
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November 2008
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Launched the compact DAL7020 laser saw with a width of only 600 mm.
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April 2009
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Launched the stealth dicing process for high-intensity LEDs.
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