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November 24, 2011

DISCO Has Developed Technology for Separating and Recovering Silicon Sludge from Grinder Wastewater

DISCO Corporation (Head Office: Ota-ku, Tokyo, President: Kazuma Sekiya) has developed the new technology which separates and recovers silicon sludge (precipitated silicon dust) from wastewater generated in the grinder during wafer backside grinding within the semiconductor manufacturing process. The DWS1820 DISCO Water-Sludge Separator (prototype) in which this technology is installed will be exhibited at SEMICON Japan 2011 (Dec. 7 to 9 at Makuhari Messe).
Development Background
In accordance with the trend toward thinner semiconductor die, the wafer grinding amount in the grinding process had increased. It is expected that the need to recycle the large amount of this silicon sludge discharged during this process, as a resource, will increase. The conventional method to recover silicon sludge requires a large number of filters, and thus costs a lot. DISCO has developed unique technology to separate solids from liquids, while providing not only cost reduction, but also highly purified silicon sludge and energy conservation in one compact unit
Features of DWS1820

Use of a unique technology to separate solid from liquid
  • Automated recovery of silicon sludge with purity of 99% or more and water content of 50% or less
  • Small footprint of 0.91m2
  • Low power consumption with maximum of 2.5 kW
  • Ability to treat up to 30 L/min (1.8 m3/h) wastewater
    (equivalent to handling one DISCO fully automatic grinder)
DWS1820
 
Future Schedule
SEMICON Japan 2011 reference exhibit: December 2011
Commercialization: In 2013 or after
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