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Newly Developed Parallel Processing Transfer System which Realizes Efficient Wafer Processing

Disco Corporation (Head Office: Ota-ku; President Kazuma Sekiya) has developed a new wafer transfer system which improves the throughput and equipment operation rate by distributing single wafers from a cassette to various equipment, allowing for parallel processing instead of using one unit to process one cassette. This system will be displayed at SEMICON Japan 2017 (December 13-15, Tokyo Big Sight).

Parallel Processing Transfer System Configuration

This system fully automates the process of allocating wafers from one cassette to multiple equipment and returns them to the cassette.

Parallel processing transfer system Fig. 1. Parallel Processing Transfer System
Dedicated lane : Conveyor to transfer wafers to the processing equipment.
Dedicated trays : Trays to house the wafers during transfer.
Cassette loader : Unit which takes out wafers one by one and loads into / unloads from the dedicated tray.
Processing equipment : Equipment (e.g., dicing saws) which can be connected to the dedicated lane.
Click here for animation
Advantages

• Improved Cassette Throughput
Generally for small chip dicing, the number of cut lines on the wafer surface increases. Also, in order to decrease chipping, the cutting speed tends to be reduced. Thus, there are cases where it takes over six hours to process all wafers (13 pieces) in a Φ300 mm/13-stack cassette using one dicing saw.
This system enables wafers from a single cassette to be processed using multiple dicing saws, leading to an improvement in the cassette throughput.

• Human Error Risk Reduction
In order to minimize the processing time for one cassette, the operator is required to manually distribute the wafers from the cassette to multiple dicing saws. By automating the wafer distribution process using this system, it is possible to reduce the risk of human errors.
Manual wafer distribution
Fig. 2. Manual Wafer Distribution
• Continuous Processing Using Multiple Processing Units
The process of dicing wafers with Low-k film (a type of insulating film) involves the removal of the Low-k film using a laser saw, followed by a cutting process using blade dicing. By connecting both units to the dedicated lane, continuous processing can be achieved without the need for cassette transfer.
Conventional cassette processing
Fig. 3. Conventional Cassette Processing

• Continuous Processing Using Multiple Processing Units
The process of dicing wafers with Low-k film (a type of insulating film) involves the removal of the Low-k film using a laser saw, followed by a cutting process using blade dicing. By connecting both units to the dedicated lane, continuous processing can be achieved without the need for cassette transfer.

Parallel Processing Transfer System (SEMICON Japan 2017 Demonstration Unit)
Parallel Processing Transfer System (SEMICON Japan 2017 Demonstration Unit)
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