Sintered metal powder is used as the bonding agent material to realize strong
As a result, these blades have low blade wear. These blades are ideal for high precision grooving
and cutting of electronics parts or optical devices.
Minimized blade wear and high cutting ability
High rigidity - minimized wavy and slant cutting
Wide range of bond types supports processing of glass and CSP
Able to control diamond concentration to achieve cutting quality
For the detailed specification and functions, view our catalogues.