Product Information

Dicing Blades

DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon, compound semiconductors, glass, ceramics, crystals, and almost any other material. They are one key to DISCO's excellence in Kiru (dicing) processing.

New Products

	Series	Application	Feature
	Z09 Series	PZT, LiTaO₃, Ceramics, Silicon wafers, etc.	The Z09 series adopts the high strength bond and meets various needs thanks to highly accurate concentration control technology.

Series	Application	Bond type	Blade type
ZH05 Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃, etc.), etc.	Electroplated bond	Hub (integrates an aluminum flange and the NBC-Z series)
ZHCR Series	Silicon wafer, etc.
ZHRF Series	Silicon, etc.
ZHFX Series	Oxide wafers (LiTaO₃), etc.
ZHZZ Series	Silicon wafers and compound semiconductor (GaAs, GaP, etc.) wafers, etc.
NBC-ZH Series	Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO₃, etc.), etc.
Z05 Series	Chip LED board, Green Ceramics, Hard and brittle material		Hubless (Washer)
ZP07 Series	Composite materials (Silicon + glass wafer etc), ceramics, etc.
NBC-Z Series	Silicon, GaAs, GaP, various types of semiconductor packages, etc.
B1A Series	Electronic parts, optical devices, various types of semiconductor packages, ceramics, mono-crystal ferrite, glass, etc.	Metal bond
P1A Series	Glass, crystal, quartz, lithium tantalate, various types of semiconductor packages, ceramics, etc.	Resin bond
R07 Series	Glass, quartz, ceramics, etc.	Resin bond
VT07 Series	For processing under high load or of hard-to-process materials (e.g., sapphire, silicon or deep groove processing) For edge trimming (silicon)	Vitrified bond
A1A/K1A Series	Ceramics, Various types of glass, Ferrite, Quartz, Crystal, Metals, etc.	A1A: Metal bond	Steel core
A1A/K1A Series		K1A: Resin bond	Steel core