DISCO's dicing blades are used with dicing and cutting saws to groove, cut, and dice silicon,
compound semiconductors, glass, ceramics, crystals, and almost any other material. They are one key to DISCO's excellence
in Kiru (dicing) processing.
|
Series |
Application |
Feature |
 |
R07
Series |
Glass, quartz, ceramics, etc. |
Resin bond hub-less blades. A wide range of blades is available to support high-grade and high-speed processing for various processing needs of hard, brittle materials.
|
 |
ZHCR
Series |
Silicon wafer, etc. |
Electroformed bond hub blades. These reduce blade tip shape collapse that easily occurs when processing with a thick blade or when there are a lot of TEG in the street. Also, these realize improved product life and processing quality. |
 |
ZP07
Series |
Composite materials (Silicon + glass wafer etc), ceramics, etc. |
Hubless blades with pores formed into the electroformed bond. Realizes high-grade processing of composite materials (such as glass + silicon wafers).
|
 |
VT07
Series |
Silicon nitride, silicon carbide, crystal, etc. ceramics, etc. |
Hubless blades using vitrified bonds. Realizes processing with a high degree of dimensional accuracy and straightness with high load processes. |
|
|
Series |
Application |
Bond type |
Blade type |
 |
ZH05
Series |
Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO3, etc.), etc. |
Electroplated bond |
Hub (integrates an aluminum flange and the NBC-Z series) |
 |
ZHRF
Series |
Silicon, etc. |
 |
ZHFX
Series |
Oxide wafers (LiTaO3), etc. |
 |
NBC-ZH
Series |
Silicon and compound semiconductor (GaAs, GaP, etc.) wafers, oxide wafers (LiTaO3, etc.), etc. |
 |
Z05
Series |
Chip LED board, Green Ceramics, Hard and brittle material |
Hubless (Washer) |
 |
NBC-Z
Series |
Silicon, GaAs, GaP, various types of semiconductor packages, etc. |
 |
B1A
Series |
Electronic parts, optical devices, various types of semiconductor packages, ceramics, mono-crystal ferrite, glass, etc. |
Metal bond |
 |
P1A
Series |
Glass, crystal, quartz, lithium tantalate, various types of semiconductor packages, ceramics, etc. |
Resin bond |
 |
A1A/K1A
Series |
A1A: Ceramics, various types of glass, Ferrite, etc. |
Metal bond |
Steel core |
| K1A: Various types of glass, crystal materials, compound materials,etc. |
Resin bond |
|
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