Product Information

P1A Series

Cutting power for hard-to-cut materials

These sintered diamond blades employ heat-hardened resin as the bonding agent which provides active self-sharpening and elasticity characteristics.
They are suitable for processing of hard-to-cut materials such as glass and crystal materials.

Features

Suitable for highly fragile materials such as glass
A wide variety of bond types are available
Able to precisely control diamond concentration to achieve cutting quality

Applicable Workpieces

Glass, crystal, quartz, lithium tantalate, various types of semiconductor packages, ceramics, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Processing Data

Comparison of cutting efficiency for bond types

The above shows the tendency of the process result when a dresser bord is cut.
Depending on the cutting conditions and type of material, the tendency may vary.
Therefore, this shall only be used as reference.

Application by grit size

Specifications

	*1	Regarding the combination of the blades Internal code and bonding strength of each blade correspond to the bond type. Please refer to the chart below.
	*2	Varies according to the blade.