Product Information

VT07 Series

The VT07 series realizes hard material processing with thin vitrified bond blades

The VT07 series employs a vitrified bond that has been difficult to manufacture into thin blades until now. These blades can process with a high degree of straightness and dimensional accuracy for high-load processing by using the high rigidity and high cut ability of the vitrified bond. As a result, this realizes quality processing for difficult to cut materials such as silicon nitride.

Features

Realizes thin blades with a vitrified bond
Able to process with a high degree of straightness and dimensional accuracy for high-load processing
Realizes high-grade processing of hardened ceramic

Applicable Workpieces

Silicon nitride, silicon carbide, crystal, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

Experimental Data

Deep-groove processing
The current blade bends during deep-groove processing. The VT07 series can achieve highly straight processing results for deep-groove processing.

Crystal processing
The VT07 series has the potential to process hard materials at a higher quality and speed than the current blade.

Cautions during usage
Note the below points on its characteristics when using the vitrified bond.

1.	Since the VT07 series is nonconductive, contact setup (conductive type) can not be used.
2.	Since there is a fear of breakage when using the VT07 series at high rpm, use at the specified rpm.
3.	When using the VT07 series on a machine with the standard BBD (Blade Breakage Detector Unit), since there is a possibility of a wrong detection, use with the BBD function turned off. *For details, contact your DISCO sales representative.