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DISCO HOME > Product Information > Dicing Blades > VT07/12 Series

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VT07/12 Series

VT07/12 Series
This bond series employs a vitrified bond that has been difficult to manufacture into thin blades so far. These blades can process with an acute degree of straightness and dimensional accuracy for highload processing by using the excellent rigidity and cutting ability of the vitrified bond. As a result, VT07/12 realizes quality processing for difficult-to-cut materials such as silicon nitride.
Thanks to the enhanced bond line-up, this bond series also realizes processing in various fields, such as edge trimming of silicon wafers.

Features
  • Realizes thin blades with a vitrified bond
  • Able to process with a high degree of straightness and dimensional accuracy for high-load processing
  • Realizes high quality processing for hard ceramics and sapphire.
  • Realizes high quality edge trimming.
Catalog Download
For the detailed specification and functions, view our catalogues.
VT07/12 Series Catalog
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