Product Information

Z09 Series

The Z09 series adopts the newly developed high strength bond and meets various needs thanks to highly accurate concentration control technology.

The Z09 series consists of electroformed bond blades for applications needing fine grit sizes, which require particularly high quality processing. Since there are five levels of concentration, a blade having a good balance of quality and life is selectable. Furthermore, thanks to the newly developed high strength bond realizes highly straight processing and increases the process speed.

Features

Increases the choices for a blade thanks to the technology realizing more detailed classification of concentration
Introduces a blade with a concentration of 30
Reduces interval dressing by selecting a low-concentration blade
Realizes highly straight processing and increases the process speed thanks to the high strength bond

Concentration range

During dicing, grit concentration affects both the speed of blade wear and the size of chipping. By selecting precisely a grit concentration that is appropriate to the application, both wear speed and process quality can be made more stable and consistent. "Grit concentration" refers to the percentage of diamond grit in the abrasive portion of the blade. For example, a grit concentration level of 100 indicates 25% diamond grit by volume.

Applicable Workpieces

PZT, LiTaO₃, Ceramics, Silicon wafers, etc.

Applicable Machines

6000 Series and 600 Series fully automatic dicing saws
3000 Series, 300 Series, and 500 Series automatic dicing saws

Specifications

	*1	Blade thickness greater than 0.1mm are available
	*2	All slit widths are 0.5mm (except for the SS type) Blade thickness greater than 0.04mm are available