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ZHRF Series

ZHRF Series
By employing new technologies, the blade strength is further improved compared to previous hub-blades. The ZHRF minimizes blade slant cutting even under high load conditions such as for high speed processing, thick wafer cutting or wafers that have a lot metal on the streets.
It also achieves a stable processing result.In addition, by combining a ZHRF blade with laser grooving for the processing of low dielectric constant (Low-k) layer wafers, backside chipping and peeling are eliminated and high speed processing is possible.

Features
  • Shows stable processing performance in high load processing.
  • Realizes high speed wafer cutting after laser grooving.
  • Supports processing required for long blade exposure.
Catalog Download
For the detailed specification and functions, view our catalogues.
ZHRF Series Catalog
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