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DISCO HOME > Product Information > Dicing and Cutting Saws

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Fully Automatic Dicing Saw
Dicing saw Fully automatic dicing saw
Fully Automatic Dicing Saw 6000 Series
Details
Facing dual-spindle dicing saw

  Max. Workpiece size Spindle Application
Layout Output
DFD6240 8" Single 1.2KW (0.19N·m)
1.8 kW(0.29 N·m)*
2.2kW (0.70 N·m)*		 Silicon, various types of glass, substrates for semiconductor packages, optical devices
DFD6340 Facing dual
DFD6341 1.2 kW (0.19 N·m)
High speed spindle*
DFD6450 Parallel dual 1.0 kW (0.16 N·m)
1.0 kW torque up
(0.24 N·m)*
2.2 kW air (0.70 N·m)*
DFD6361 300 mm Facing dual 1.2 kW (0.19 N·m)
DFD6362 1.2 kW (0.19 N·m)
High speed spindle*
DFD6760 Facing dual
(Dual chuck table)
(*) Optional Specification


Fully Automatic Dicing Saw 600 Series
Details
Parallel dual-spindle dicing saw

  Max. Workpiece size Spindle Application
Layout Output
DFD641* 8" Single 1.0 kW (0.16 N·m) Silicon, Compound semiconductor wafers, various types of glass
DFD651* Parallel dual
DFD660* 300 mm Single
DFD670* Parallel dual
DFD681* 8" Single 2.2 kW (0.70 N·m)
DFD691* Parallel dual
(*) Discontinued Machines


Automatic Dicing Saw
Automatic dicing saw
Automatic Dicing Saw 3000 Series
Details

  Max. Workpiece Size Spindle Application
Layout Output
DAD3220 6" (6" square) Single 1.5 kW (0.48 N·m) Silicon, Compound semiconductor wafers, various types of glass
DAD3230 6" square
8" x 6" *
DAD3430
DAD3350 8"
250 mm square		 1.8 kW (0.29 N·m)
2.2 kW (0.70 N·m)*
DAD3650 Facing
dual		 1.8 kW (0.29 N·m)
(*) Optional Specification

Automatic Dicing Saw 300 Series
Details

  Max. Workpiece size Spindle Application
Layout Output
DAD321 160 x 160 mm Single 1.5 kW (0.48 N·m) Silicon, Compound semiconductor wafers, various types of glass
DAD322 ø6"
(6"square)*2
DAC351*1 153 x 153 mm
DAD361*1 160 x 160 mm
DAD381*1 304.8 x 304.8 mm 1.0 kW (0.16 N·m)
(*1) Discontinued Machines
(*2) A special jig is required for this function.


Automatic Dicing Saw 500 Series
Details

  Max. Workpiece size Spindle Application
Layout Output
DAD522* 8" Single 1.5 kW (0.48 N·m) DAD:Silicon, Compound semiconductor wafers, Thick/Hard substrates DAC:magnetic heads
DAC552* 220 x 160 mm 1.0 kW (0.16 N·m)
DAD562* 8" 1.5 kW (0.48 N·m)
(*) Discontinued Machines


Automatic Dicing Saw 600 Series
Details

  Max. Workpiece size
 Spindle Application
Layout
 Output
DAD685*1 250 x 250 mm Single 1.0 kW (0.24 N·m)
2.2 kW (1.0 N·m)*2		 Package Singulation
DAD685*1 Parallel dual
(*1) Discontinued Machines
(*2) Optional Specification



Accessory Equipment

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