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DISCO HOME > Product Information > Dry Polishing Wheels > DP08 Series

Product Information


DP08 Series

DP08 Series
The DP08 series enables polishing of ultra-thin wafers with DISCO's unique dry polishing process. In addition to having a low environmental impact by not using chemicals, it achieves high die strength and is simple to operate compared to a process that uses slurry.

Features
  • Low environmental impact due to the process requiring no slurry
  • High die strength thanks to the original dry polishing process
Catalog Download
For the detailed specification and functions, view our catalogues.
DP08 Series Catalog (PDF:456KB)
Inquiry
If you have any questions or need to discuss something, please feel free to contact us.
Contact form Check your nearest DISCO sales office

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