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DISCO HOME > Product Information > Grinders > Fully Automatic Grinder 8000 Series

Product Information


Fully Automatic Grinder 8000 Series

Grinder
The 8000 Series grinders perform loading, grinding, cleaning and drying, and unloading with just the touch of a button. The LCD touch panel with graphical user interface makes operation easy to master. In addition, 8000 Series grinders are in-line-compatible with DBG (Dicing Before Grinding), DISCO polishers (DFP8140, DFP8160), and a variety of tape machines.

In-feed grinding
Fully Automatic 8000 Series Fully Automatic 800 Series Automatic 800 Series
  DFG8540
DFG8540/8560 Catalog
DFG8560
DFG8540/8560 Catalog
DFG8540
DFG8560
Wafer Diameter Max ø 8" (ø 4" - ø 8") Max ø 300 (ø 8" - ø 12")
Models 2-spindles, 3-rotary-chuck table
Application Ultra-thin grinding (100 オm or less)
Grinding Method In-feed grinding with wafer rotation
Spindle Type Air bearing with high frequency motor
Number of axes 2
Output(kW) 4.2 4.8
Revolution speed(min-1)[rpm] 1,000 - 7,000 1,000 - 4,000
Z-axis vertical stroke(mm) 120 (with zero point)
Z-axis vertical grinding feed speed
(mm/s)
0.0001 - 0.08
Z-axis vertical fast feed speed(mm/s) 50
Min. Z-axis vertical movement(um) 0.1
Min. Z-axis vertical movement resolution(um) 0.1
Height Gauge Measurement range(um) 0 - 1,800
Resolution(um) 0.1
Repeatability(um) ±0.5
Wafer Chuck Table Chuck table type Porous chuck table
Chuck method Vacuum
Number of revolutions 0 - 300
Number of chuck tables 3
Chuck table cleaning Backflushing of water and compressed air is combined with oilstone cleaning and brush cleaning
Spark Out (chuck table revolutions setting) 0 - 999
Grinding Wheel Diamond wheel(mm) ø 200 ø 300
Wafer Handling Section / Wafer Cleaning Section Cassette storage quantity 2
Cassette flow Same flow and open flow
Spinner unit Water washing and drying
Vacuum Unit Discharge speed 29/36 (m3/h) 50/60 (Hz)
Achievable pressure(kPa·G) -90 (water supply temperature 15ーC, water supply flow rate 1L/min)
Electric motor(kW) 1.5
Water flow rate(L/min) When supplied water temperature is greater than 22ーC : 3
When supplied water temperature is less than 22ーC : 1
Grinding Accuracy Thickness variation within one wafer(um) less than 1.5 (when grinding ・8" wafers with included chuck tables)
Thickness variation between wafers(um) less than ±3
Finish surface roughness(um) Ry 0.13 (with #2000finish)
Ry 0.15 (with #1400finish)
Machine dimensions
(W x D x H) (mm)
1,200 x 2,670 x 1,800 1,400 x 3,322 x 1,800
Machine weight (kg) Approx. 3,100 Approx. 4,000
*

The above specifications may change due to technical modifications. Please confirm when placing your order.



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