| |
DFG830 |
| Wafer Diameter |
Max ø 8" (ø 6" - ø 8")
 |
| Models |
2-spindles, 3-rotary-chuck table |
| Application |
Dual-side wafer grinding and lowered TTV |
| Grinding Method |
'In-feed grinding with wafer rotation |
| Spindle |
Type |
Air bearing with high frequency motor
|
| Number of axes |
2 |
| Output （kW） |
4.2 |
| Revolution speed (min-1)[rpm] |
1,000 - 7,000 |
| Z-axis vertical stroke (mm) |
110 |
Z-axis vertical grinding feed speed
(mm/s) |
0.0001 - 0.08 |
| Z-axis vertical fast feed speed (mm/s) |
50 |
| Min. Z-axis vertical movement (µm) |
0.1 |
| Min. Z-axis vertical movement resolution
(µm) |
0.1 |
| Height Gauge |
Measurement range (µm) |
0 - 1,000 |
| Resolution (µm) |
0.1 |
| Repeatability (µm) |
±0.5 |
| Wafer Chuck Table |
Chuck table type |
Porous chuck table
|
| Chuck method |
Vacuum
|
| Number of revolutions |
0 - 300 |
| Number of chuck tables |
2 |
| Chuck table cleaning |
Washing with the water flow/air blow system and oilstone
|
| Spark Out (chuck table revolutions setting) |
0 - 999 |
| Grinding Wheel |
Diamond wheel (mm) |
ø 200 |
| Wafer Handling Section
/ Wafer Cleaning Section |
Cassette storage quantity |
4 |
| Cassette flow |
Same flow
|
| Spinner unit |
Water washing and drying
|
| Vacuum Unit |
Discharge speed |
29/36 (m3/h) 50/60 (Hz) |
| Achievable pressure (kPa·G) |
-90 (water supply temperature 15ｰC,
water supply flow rate 1L/min) |
| Electric motor (kW) |
1.5 |
| Water flow rate (L/min) |
When supplied water temperature is greater
than 22 ｰC:
3
When supplied water temperature is less than 22ｰC: 1 |
| Grinding Accuracy |
Thickness variation within one wafer (µm) |
Less than 1.5 (when grinding ・8" wafers
with included chuck tables) |
| Thickness variation between wafers (µm) |
less than ±1.5 |
| Finish surface roughness (µm) |
Approx. Ry 0.13 (with #2000 finish)
Approx.
Ry 0.15 (with #1400 finish) |
Machine dimensions
(W x D x H) (mm) |
1,050 x 2,450 x 1,710 |
| Machine weight (kg) |
Approx. 2,500 |
