Product Information

GF01 Series BT100

BT100, a newly developed resin bond for rough grinding wheels, offers ultra-high grinding quality.

BT100, a newly developed bond for rough grinding wheels, supports wheel life comparable to that of standard vitrifed bond. At the same time, BT100 helps reduce edge chipping and grinding damage, making it an ideal for use in ultra-thin grinding.

Features

Newly developed resin bond offers ultra-high grinding quality.
Life comparable to that of standard vitrifi ed bond wheels.
Consistent and highly precise grinding results.
New wheel base (GF01) offers highly effective delivery of coolant water.

Wheel comparison

Applicable Workpieces

Silicon wafer and others.

Applicable Machines

DAG800 Series, DFG800 Series and DFG8000 Series grinders DGP8000 Series polishers

Specifications

Note: Due to ongoing research and development, product specification is subject to change without notice.

Comparative Data with Previous Wheels

With the increase in ultra-thin grinding applications for silicon, in recent years there has been a need for process quality improvements during the rough grinding stage, including reduced edge chipping and grinding damage layers. In response, DISCO has added to the GF01 Series wheel lineup the BT100 bond, which features extremely high grinding quality while comparable to that of standard vitrified bond.

Edge chipping