Product Information

GF01 Series

Improved Grinding Performance and Consistency

The newly developed GF01 Series in-feed grinding wheels feature a special aluminum base unique to DISCO. This base delivers coolant water even more efficiently than that of the IF series, resulting in highly consistent processing and optimized wheel life.

Features

Special wheel base delivers coolant water in a highly efficient manner
Suitable wheel life
Compatible with the conventional IF series
Polypropylene packaging - environmentally friendly

Rough grinding

A combination of high rigid vitrified bond and large diamond grit easily handles a wide variety of substrates, as well as tough oxide and nitride layers. Designed for high performance, GF01 Series rough-grinding wheels deliver consistent processing resullts.

	VS	: Standard bond
	V202	: Lower-density bond for processing oxide layer wafers

Fine grinding

Specially-formulated resin bonds allow for reduced depth of damage and highly dependable grinding quality.Designed for improved TTV and surface roughness, GF01 Series fine-grinding wheels combine high processing quality with optimized wheel life.

	B-K01	: For enhanced grinding performance
	V202	: For reduced wheel wear
	B-K04	: For general fine grinding (DISCO standard bond)
	B-K09	: For high-load grinding

Applicable Workpieces

Silicon and compound semiconductor wafers, crystal and ceramics for electronics components, many other substrates and materials, etc.

Applicable Machines

Specification

Standard wheel types

Bond selection will vary by application; please contact your DISCO representative for assistance.

Precision Machines

Dicing and Cutting Saws

Laser Saws

Grinders

Polishers and Dry Etchers

Surface Planer

WaterJet Saw

Products for New Processes

Precision Processing Tools

Other Products

Accessory Equipment