The IF Series in-feed grinding wheels are excellent for processing not only silicon, but also compound semiconductors, ceramics, crystals, and a wide range of other materials. In addition, DISCO offers applications and IF Series wheels to match virtually any wafer size or processing requirement.
Superior finishing quality
Long-life specification - high wear resistance
Large product range - able to process compound semiconductor wafers and crystal materials for electronic component
Uses packaging made with environmentally - friendly PP or ABS resin.
For the detailed specification and functions, view our catalogues.