DISCO's grinding wheels grind silicon, compound semiconductors, crystals, and a wide variety
of other materials. They are an essential part of DISCO's excellent Kezuru (Grinding) solutions.
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Series |
Application |
Feature |
 |
IF Series |
Silicon and compound semiconductor wafers, crystals and ceramics for electronic components, and many other substrates and materials, etc. |
Standard grinding wheels with extensive record of success |
 |
GF01
Series |
New wheel series featuring advanced coolant water delivery |
GF01
Series
BT100/BT300 |
By employing the newly developed resin bond, it realizes lower edge chipping and grinding damage, and is the optimum 1-axis bond for thin grinding. |
 |
GF01
Series
BR385 |
Borosilicate glass, non-alkali glass, crystal,various glass types, etc. |
Grinding wheels using resin bonds. Realizes stable continuous grinding without the need of interim dressing, and making possible the high-grade grinding of glass. |
 |
GS08
Series |
SiC, Al2O3, Si3N4, etc. |
Porous vitrified bond, fixed abrasive wheels resulting in high quality grinding of SiC wafers. |
 |
Poligrind |
Silicon wafers, etc. |
Poligrind offers a new dimension in ultra-high-quality grinding. |
 |
Ultra
Poligrind |
Silicon wafers, etc. |
This new finish grinding wheel achieves high die strength while maintaining gettering performance. |
 |
RS Series* |
Silicon and compound semiconductor wafers, crystals
and ceramics for electronic components, and many other substrates and materials, etc. |
Purpose-built wheel for creep-feed grinding method. |
|
| * The DFG-83H/6 is no longer sold, however the supply of the RS Series continues. |
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