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DISCO's dicing saws cut semiconductor wafers (Si, GaAs, etc.), glass, ceramic, and a wide variety of other materials at a level of precision measured in micrometers (1/1000 of a millimeter). DISCO's cutting saws cut magnetic heads and other specialty materials with similarly high precision. |
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DISCO's laser saws deliver laser full-cut dicing and grooving at high speed and quality for processing diffi cult to cut materials and devices, which previously could only be cut with a dicing blade.
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DISCO's grinders process semiconductor wafers (Si, GaAs,
etc.), crystals (quartz, sapphire, etc.), ceramics, and many other materials to ultra-thin
levels with excellent precision and consistency. |
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DISCO's polishers provide stress relief by means of the dry polishing process, which uses no chemicals or slurry-not even water. Dry polishing increases die strength and flatness while offering lower environmental impact and reduced cost of ownership. DISCO's dry etcher realizes significant die strength with the side-etching effect of the plasma. |
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DDS2300 is fully automatic die separator to precisely separate DAF (Die Attach Film), which is necessary for thin die stacking. |
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This machine uses a diamond bit for high precision planarization of ductile materials (such as gold, copper and solder), resins (such as photoresists and polyimides) and composites of these materials. |
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In the DAW4110, abrasive material, which is discharged from a nozzle together with pressurized water, is used to cut the workpiece, and achieves high-grade non-thermal curvilinear processing. |
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Complementing its expertise in dicing, grinding, and other
core processes, DISCO works closely with allied materials and equipment manufacturers to
provide customers new and advanced processes. |
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Precision Processing Tools
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DISCO's extensive line of blades, designed especially for dicing and cutting saws, can handle a wide range of Kiru applications: from ultra-thin hub blades for semiconductor wafer dicing to thicker, larger-diameter blades for heavy-duty cutting. |
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DISCO's grinding wheels handle both basic and specialty Kezuru applications with excellent precision and consistency. They are particularly suited to the ultra-thin grinding of silicon and compound semiconductor wafers. |
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In combination with DISCO polishers, DISCO's dry polishing wheels give semiconductor wafers a mirror finish for excellent stress relief. |
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DISCO offers a range of accessory equipment to enhance the precision, accuracy, consistency, and process quality of DISCO solutions. These accessories can also help reduce environmental impact and improve cost of ownership. |
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DISCO offers a range of high-quality frames and cassettes for effective securing and handling of workpieces, and an additive that is expected to improve processing quality. |
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