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DISCO HOME > Product Information > Fully Automatic Laser saw

Product Information


7000 Series - Fully Automatic Laser saw -

Laser Saw
The 7000 Series Laser Saw performs loading, alignment, laser processing (Full cutting, grooving and inner-modifying process), cleaning, drying and unloading with just the touch of a button. The Laser Saw features a short-pulse ultraviolet laser that processes workpieces with virtually no heat. In addition, the LCD touch panel with dicer-based graphical user interface makes operation easy to master.
Laser processing method introduction  
Ablation processing
 compliant products
Process method where solids can be vaporized or sublimated by focusing laser energy on a extremely small area for a short time.
<Ablation processing Applications>
Low-k Grooving
Laser Full Cut Dicing
DBG + DAF Laser Cut
Stealth dicing
 compliant products
This is a dicing method that forms a modified layer in the workpiece, by focusing a laser inside the workpiece, and then implements die separation with a machine such as a tape expander.
For Ablation processing For Stealth dicing
DFL7160
DFL7160 Catalog
DFL7260
DFL7260 Catalog
DFL7160 DFL7260
Models ø300 mm wafer, ablation processing compliant laser saw ø300 mm wafer, ablation processing compliant two-head laser saw
Max. Workpiece Size (mm) ø300 mm
Max. Applicable
tape frame size
2-12
X-axis
(Chuck table)
Processing range (mm) 310
Max. processing speed (mm/s) 600 1,000
Y-axis
(Chuck table)
Processing range (mm) 310
Index step (mm) 0.0001
Index positioning accuracy 0.003/310
(Single error) 0.002/5
Scale resolution (mm) 0.0001 0.00005
Z-axis Input range for lens height (mm) -2,000 to 5,000
Moving resolution (mm) 0.00005
Repeatability accuracy (mm) 0.002
θ-axis
(Chuck table)
Max. rotating angle (deg.) 380
(320° in the positive (+) direction and 60° in the nagative (-) direction from the initial position)
380
(245° in the positive (+) direction and 135° in the negative (-) direction from the initial position)
Laser Oscillator Oscillator Model Semicondutor laser diode (LD) excitation Q-switch solid laser Semicondutor laser diode (LD) excitation Q-switch solid laser x 2
Machine dimensions
(W x D x H) (mm)
1,200 x 1,550 x 1,800 2,800 x 1,220 x 1,800
Machine weight (kg) Approx. 1,750
(without transformer)
Approx. 1,870
(with transformer)
2,900
(ncluding UPS)
*

DFL7260
A chiller unit is placed outside the machine. 1200 x 650 x 1558 mm (chiller unit dimensions)

*

The above specifications may change due to technical modifications. Please confirm when placing your order.

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