Product Information

Cutting Water Additives for Dicing - StayClean-A -

Effectively prevents particle adhesion on the wafer

StayClean-A increases the wetness of the workpiece surface and prevent particles from adhering due to dryness. In addition, air bubbles generated by the cleaning ingredient decreases the sedimentation velocity of particles. As a result, particle adhesion on the workpiece surface will be greatly reduced. Since the StayClean-A demonstrates the highly effective particle adhesion prevention regardless of the type of workpiece, it produces a great effect even with workpieces having high water repellency such as image sensors and wafers with resin film.

< Effects in particle adhesion prevention >

DI water only