Product Information

Cutting Water Additives for Dicing - StayClean-F -

Pad corrosion protection

By forming a barrier layer on the workpiece surface, the StayClean-F protects workpieces including large diameter wafers and small die which will be exposed to cutting water for a long time from corroding at a metal area such as bonding pad.

< The effect on pad corrosion prevention >

DI water only

When using StayClean-F

Particle adhesion prevention

In addition to forming a barrier layer on the workpiece surface, by preventing Si particles from aggregation, the adhesion of particles to a wafer can be avoided.

< Effects in particle adhesion prevention >

DI water only