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DISCO HOME > Product Information > DFS8910　- Fully Automatic Surface Planer -

Product Information

DFS8910　- Fully Automatic Surface Planer -
Surface Planer
The DFS8910 lowers connection defects by planarizing Au bumps on LCD drives and makes the bumps dimpleless.
From loading a wafer, washing it after processing and up through unloading it back into the cassette, all wafer handling is automatic. Furthermore, the DFS8910 supports processing of resin and ductile metals (gold, copper, and aluminum), and attains high-level planarization.
Introducing processing example
Cutting and Planarization Using a Surface Planer
DFS8910
DAD7160 Catalog
DFS8910
Wafer Diameter Max ø 8"
Spindle Type Water cooled air spindle
Number of axis 1
Height Gauge Available
Chuck Table Chuck type Vacuum chuck
Number of chuck tables 1
Wafer Transfer / Cleaning Unit Number of cassettes 2
Process Precision Bump height variation within the wafer (µm) Less than 2.0
Bump height variation within the die (µm) Less than 1.0
Bump surface roughness (µm) Ra less than 0.02
Machine dimensions
(W x D x H) (mm)		 1,200 x 2,670 x 1,800
Machine weight (kg) Approx. 1,900
*

The above specifications may change due to technical modifications. Please confirm when placing your order.
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