The DBG (Dicing Before Grinding) process, effective in reducing the incidence of backside chipping during dicing, is usually utilized when processing silicon wafers, however it is also effective when processing hard, brittle materials such as glass.
Details
As the name suggests, the DBG process involves firstly forming a half cut before backgrinding the workpiece, which also has the effect of singulating the die as well as reducing the incidence of backside chipping. As shown in the following photographs, DBG markedly reduces chipping in glass processing.
DBG (backside)
Dicing (full cut, backside)
Processing results may vary depending on the glass type, final thickness and die size.
