Solutions

Applications Example

The process of ring removal for TAIKO wafer by circle cutting

Up until now a process called ring grinding has been used to remove the ring left over from TAIKO grinding. We have now developed a process of ring removal by circle cutting with a blade dicer.

Advantages of ring removal by circle cutting

	-	A simplified process with less tape mounting compared to the ring grinding process
	-	Frame handling reduces the risk of breakage when handling thin wafers