6-inch GaAs Wafer Thinning when it is Secured with Tape
The results of our thinning process of 6-inch GaAs wafers affixed with tape will be introduced.
A 90 µm finish could be realized without any problem when a 6-inch GaAs wafer was processed after being secured with tape. Its handling did not produce any problem. The wheels used were #600 and #4800 for rough and finish grinding respectively.